Failure Analysis Request Form - Innovative Circuits Engineering, Inc. - Printed Circuits Boards for Burn-in, Cycling, Hast, Test load boards, ESD fixtures and various test Adaptors with the aid of design tools methodology.

Failure Analysis Request Form:

To help us better serve you, please provide a complete your requests of this Failure Analysis Request. A Sales Technical will respond to you by email or phone within 24-hours.

* Company:
* Contact name:
* Telephone:
* Fax:
* Date Received:

* E-mail:
* Address:
* City, State, Zip:
* PO#:
* Quote#:

PRODUCT DESCRIPTION:

Top Mark:

Bottom Mark: .

Package Type:

Part #

Lot #

Process Geometry:

# of Metal Layers:.

Other Useful Information:

ANALYSIS REQUESTED:

		DECAP
		X-RAY (Static)
		X-RAY (Real Time)
		LIQUID CRYSTAL/HOT SPOT ANALYSIS.
		ESD/EOS/LATCHUP FAILURE ANALYSIS
		PACKAGE CROSS SECTIONING
		PACKAGE/SUBSTRATE LAPPING
		SEMICONDUCTOR DIE PARALLEL LAPPING
		SEMICONDUCTOR DIE PROCESSING
		OTHER (Specific):

TURN AROUND TIME:

STD TURN:

EXPEDITE:

LINE DOWN:

Your submission will be emailed to SUPPORT@icenginc.com

Innovative Circuits Engineering, Inc. is committed to providing our
customers services and products with highest quality and on time delivery.