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Failure
Analysis Service
Innovative
Circuit Engineering, Inc. provides Level 1 and Level 2
Failure Analysis Services for its customers. Most
problems that occur with microelectronic devices can
be detected with the Failure Analysis Techniques that we
can provide:
Level I:
1. I/V
Characterization (Curve Trace)
2. Optical
Microscopic Examination
3.
Chemical or
Mechanical Decapsulation
4. Real
Time X-Ray
5.
Scanning Acoustic
Microscopy (C-SAM)
6.
Report Documentation
Level II:
1.
Liquid Crystal Analysis
2.
Chemical
Deprocessing
3.
Parallel
Lapping
4.
Cross
Sectioning |
