Innovative Circuits Engineering, Inc. provides Failure Analysis Services for its customers. Most problems that occur with microelectronic Devices can be detected with the Failure Analysis Techniques that we can provide:

.:: I/V characterization (curve trace)
.:: Microprobing
.:: Picoprobing up to 3 GHz
.:: Optical microscopic examination
.:: Chemical or mechanical decapsulation
.:: Real time X-ray
.:: Scanning Acoustic Microscopy (C-SAM)
.:: Scanning Electron Microscopy (SEM) systems
.:: Energy Dispersive X-ray analysis (EDX)
.:: Emission Microscopy
.:: Hot spot analysis
.:: Chemical deprocessing
.:: Plasma etching
.:: Parallel lapping
.:: Cross sectioning
.:: Ball Shear / Bond Pull
.:: Failure analysis reports