Innovative Circuits Engineering Expands its Services

I am pleased to advise that Innovative Circuits Engineering is now in a position to provide additional services to its customers.

Following the acquisition of new equipment, the company has upgraded its ESD and Latch-up capabilities. The new state- of- the-art Zap Master Mk. 2 tester raises the ESD test capability to 768 Pins and allows vectored Latch-Up tests at high speeds. It also has the capability of Latch-up testing up to 5 power supplies.

The company has also started providing full range of Failure Analysis Services. This follows the recent addition of equipment with the ability to do advanced package descapsulation, utilizing the Nisene D Cap -Delta and, B&G 250 Etcher, for standard package decapsulation. We have also acquired X-Tek Real -Time X-Ray System, VTX160. Capability already exists in the company for other services like Low and High Power Visual Inspections, Die Deprocessing, Cross-Sectioning, Lapping, Curve Tracer Analysis, Scanning Acoustic Microscopy (SAM) and Failure Analysis Reporting. For customer convenience, all FA requests can be channeled to a separately allocated E-mail: fa_lab@icenginc.com.

In addition to the above, the company has acquired the capability to conduct electrical testing of memory devices utilizing Sentry 90 and Genesis II testers.

The expansion into new areas recognizes the need to provide a wider range of services to our customers and is thus a logical extension of the existing services in Reliability Qualification, PCB Design and Assembly, provided over the last 10 years.

We, in the company, are excited about these developments, given that they provide the opportunity to fulfill the needs of our customers better. We would welcome your visit to our premises to see the new service capabilities.

We have always valued your business and remain committed to providing quality service. 


Sincerely,
Narendra Narayan
CEO/President
Innovative Circuits Engineering, Inc.