-
Reliability Testing
- HTOL (High Temp. Operating
Life)
- High Power Burn-in
- LTB (Low Temp. Burn-in)
- THB (Temperature Humidity
Bias)
- HAST (Highly Accelerated
Stress Test)
- TC (Temperature Cycling)
Air-to-Air
- TS (Thermal Shock) Liquid-to-Liquid
- PP (Pressure Pot)
- HTS (High Temp. Storage)
- Vapor phase/ air convection
simulation
- Preconditioning per
JEDEC-A113, all levels
- Mark permanency
- Solderability
|
-
Failure Analysis
- I/V characterization
(curve trace)
- Microprobing
- Picoprobing up to 3
GHz
- Optical microscopic
examination
- Chemical or mechanical
decapsulation
- Real time X-ray
- C-SAM (Scanning Acoustic
Microscopy)
- SEM (Scanning Electron
Microscopy)
- EDX (Energy Dispersive
X-ray analysis)
- Emission Microscopy
- Hot spot analysis
- Chemical deprocessing
- Plasma etching
- Parallel lapping
- Cross sectioning
- Failure analysis reports |